1. 2. 3. material content data sheet sales product name igb30n60t issued 29. august 2013 ma# MA000960982 package pg-to263-3-2 weight* 1558.20 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.481 0.16 0.16 1592 1592 leadframe non noble metal iron 7439-89-6 0.304 0.02 195 inorganic material phosphorus 7723-14-0 0.091 0.01 59 non noble metal copper 7440-50-8 304.026 19.51 19.54 195113 195367 wire non noble metal aluminium 7429-90-5 2.697 0.17 0.17 1731 1731 encapsulation organic material carbon black 1333-86-4 10.311 0.66 6617 plastics epoxy resin - 113.424 7.28 72792 inorganic material silicondioxide 60676-86-0 563.683 36.18 44.12 361752 441161 leadfinish non noble metal tin 7440-31-5 9.657 0.62 0.62 6197 6197 plating non noble metal nickel 7440-02-0 0.228 0.01 147 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 0 147 solder noble metal silver 7440-22-4 0.073 0.00 47 non noble metal tin 7440-31-5 0.058 0.00 37 non noble metal lead 7439-92-1 2.789 0.18 0.18 1790 1874 heatspreader inorganic material phosphorus 7723-14-0 0.165 0.01 106 non noble metal iron 7439-89-6 0.548 0.04 352 non noble metal copper 7440-50-8 547.666 35.15 35.20 351473 351931 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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